3D glass-based integrated photonics components supplier Optoscribe Ltd, says it is now sampling OptoCplrLT™, its monolithic glass chip for low-loss coupling to silicon photonics (SiPh) grating couplers. Created using Optoscribe’s proprietary high-speed laser writing technique, OptoCplrLT™ is designed to overcome fibre-to-SiPh photonic integrated circuit (PIC) coupling challenges to enable high volume automated assembly and help drive down costs.
The chip uses low-loss light turning curved mirrors, which are formed in the glass, to direct the light to or from the SiPh grating couplers. This, says the company, prevents the need for bend-tolerant fibre solutions, which are often expensive, challenging to manufacture and have some significant limitations in size and profile.
OptoCplrLT™ has a low-profile interface, ~1mm device height and ~1.5mm with cap, which allows compact interface layouts that alleviate packaging constraints and helps address footprint challenges. Optoscribe’s solution is also compatible with industry-standard materials and processes; for example, the glass chip has a coefficient of thermal expansion matched to the silicon chip, helping to maximise performance.
Russell Childs, CEO of Optoscribe said, “We are pleased to announce that we are now sampling OptoCplrLT™, which offers data centre operators, transceiver manufacturers and optical component suppliers an innovative solution to help address fibre-to-SiPh PIC coupling challenges and help overcome SiPh transceiver packaging and integration hurdles, while meeting market demands of performance, cost and volume.”
For more information, visit www.optoscribe.com