CompoundTek, Ningbo Hyper-silicon, collaborate on Data Comms SiPh testing

News and Business

Singapore-based SiPh foundry service provider CompoundTek Pte.Ltd, has formed a strategic collaboration with Ningbo Hyper-silicon Technology Co.Ltd, a China-based transceiver solution provider for data centres, to establish a cost-effective high-volume SiPh Wafer Edge Coupling Test.

The partnership leverages CompoundTek’s existing wafer test solutions portfolio and aims to address the growing need for cost-effective testing capabilities with comprehensive coverage to identify known good dies at the wafer level and eliminate or reduce the need to perform die-level testing. It also taps into performance testing of the edge coupler, which is conducted in simulations akin to real-world or end-user applications, enabling SiPh product companies like Hyper-silicon to have faster yield feedback. Capturing potential excursions in the fab earlier minimises the cost of yield dropouts in the later stages of the packaging process.

Raj Kumar, founder and CEO of IGSS Ventures, the holding company for CompoundTek said, “We have been working to push the present technical boundaries in SiPh testing that allow for SiPh mass productions and are excited to work with like-minded customers like Ningbo Hyper-silicon. CompoundTek believes technology innovations in cost-effective and efficient test strategies capable of detecting defective dies or dies that do not meet the expected performance at the wafer level are key to wider adoption in the SiPh wafer-level edge coupling test space.”

Ningbo Hyper-silicon’s Founder Yang Ming adds, “The high growth of demand for our product requires us to test our SiPh chips in both timely and cost-efficient ways to meet our end customer demand. A repeatable and reliable SiPh wafer-level electro-optical testing test platform is critical to achieving this goal. CompoundTek’s edge coupling wafer test solution meets our criteria, leading to improved quality control for the manufactured chips and identifying failures in the earlier assembly steps, allowing us to focus on Hyper-silicon’s core competencies in chip architecture and design.”

In September 2020, CompoundTek announced it was working with Nanyang Technological University, Singapore (NTU Singapore) on a three-year joint advanced research and development collaboration for O, C, L-band silicon photonics tuneable lasers for communications and other emerging applications.

For more information, visit www.compoundtek.com