Technologies and ProductsSENKO was been awarded new patents relating to advancements in the company’s MPO, LC and VSFF product portfolios. They cover solutions to address polarity change features, push/pull boot latching method, a design to improve IR and dust protection for MPO ferrules and numerous additional advancements to strengthen their VSFF portfolio. The newly […]
Technologies and ProductsSumitomo Electric Industries, Ltd. and US Conec, Ltd. Have signed a license agreement to jointly manufacture MMC connector and TMT ferrule components for next-generation, high-density, multi-fibre cabling solutions. US Conecʼs MMC connector combines a reduced footprint multi-fibre ferrule with a very small form factor (VSFF) connector footprint, which is 1/3 the size of the MPO […]
Technologies and ProductsSenko has launched its next generation duplex optical fibre connector designed for high density applications, which doubles transceiver face plate density. The connectors can be used for next generation transceivers including SFP-DD, QSFP-DD and OSFPVSFF. The compact design of Senko’s Very Small Form Factor (VSFF) duplex SN® fibre connectors allow significant space-saving in data centre […]
Technologies and ProductsSenko Advanced Components, Inc. has received several patents for its VSFF (Very Small Form Factor) from the U.S. Patent and Trademark Office. Senko has received U.S. Patent No. 11,280,972 on the first ever LC ferrule connector to allow eight fibres in a QSFP transceiver footprint. Senko has also received patents on its SN connector (including […]