TE Connectivity

Technologies and Products

OFC 2023: TE, Intel, demo 224G PAM4 over passive copper

By Peter Dykes

TE Connectivity, in collaboration with Intel, is demonstrating its 224 Gbps PAM4 long reach development efforts at OFC 2023. The first demo consists of Intel’s 224 Gbps test chip addressing TE’s over-the-board (OTB) architecture consisting of a 224 near-chip cable assembly. TE’s 224 Gbps AdrenaLINE Catapult product helps enable premium signal integrity channels for near-chip […]

News and Business

OFC: Ranovus, TE, first with monolithic 800G optical interconnect

By Peter Dykes

Ranovus and TE Connectivity are collaborating to deliver what the companies claim is the world’s first CPO platform based on RANOVUS’ Odin™ 800Gbps Analog-Drive CPO 2.0 architecture with TE’s CPx fine pitch socket interposer technology. The CPO implementation, the result of a three-year development cooperation between RANOVUS and TE, showcases a fully operational co-packaged optical […]