Applications and ResearchTerranova project looks beyond 5G – to next generation
(pictured, left) In the TERRANOVA project, Fraunhofer IAF is focusing on the integration of wireless modules at the chip level. The image shows a functional prototype of a 300 GHz multichannel wireless system for further integration as a system-on-chip. The scientists demonstrated their research in the project TERRANOVA at the Productronica trade fair in Munich […]