OFC 2024: Broadcom extends AI optical component portfolio

Created March 13, 2024
Technologies and Products

Broadcom Inc, has announced an expanded portfolio of optical interconnect solutions for AI and ML applications. Broadcom’s optics technologies facilitate high speed interconnects for front-end and back-end networks of large-scale generative AI compute clusters.

The company will be using OFC to announce the production release of 200-Gbps per lane (200G/lane) electro-absorption modulated laser (EML) to pair with next generation GPUs. It will also be demonstrating what it says is the industry’s first 200G/lane vertical-cavity surface-emitting laser (VCSEL), along with a continuous wave (CW) laser with high efficiency and high linearity for silicon photonics (SiPh) modulation at 200G. The company is also announcing shipments of more than 20 million channels of 100G/lane high speed optical components used in AI/ML systems.


“Generative AI has unleashed a network transformation necessitating an order of magnitude increase in high-speed optical links compared to standard network requirements,” said Near Margalit, vice president and general manager of the Optical Systems Division at Broadcom. “We will continue to invest in VCSEL, EML and CW laser technologies to deliver disruptive innovation in bandwidth, power and latency for optical interconnects in next generation AI links.”

“We expect shipments of 8x100G optical transceivers to exceed 5 million units in 2024 and first 8x200G modules delivered to customers by the end of the year,” commented Dr. Vladimir Kozlov, founder and CEO of LightCounting Market Research. “Google and Nvidia will be the first adopters of 200G per lane optics for interconnecting GPUs and TPUs in AI Clusters – the hottest area of the market now. Broadcom is once again among the first suppliers of components enabling the next generation of optical transceivers.”

“Enterprises continue to demand larger AI clusters, elevating the importance of cutting-edge optical interconnects,” said Craig Thompson, vice president of LinkX products at NVIDIA. “NVIDIA is at the forefront of photonics innovation, and Broadcom has been an important optical-component partner, matching the pace and scale required as we advance our HPC and AI optical-interconnect technology.”

“At Innolight, we have been deploying leading-edge optical interconnect solutions for AI, ML and HPC applications,” Osa Mok, chief marketing officer (CMO) at Innolight Technology. “We are excited to continue our partnership with Broadcom to develop advanced terabit optical modules for generative AI, enabling AI clusters to scale and support the next generation of LLMs.”

“Eoptolink is deeply invested in AI/ML optical transceiver technologies with a broad portfolio of advanced high-speed module offerings,” Sean Davies, vice president of sales at Eoptolink Technology. “We are excited to partner with Broadcom to bring to market state-of-the-art solutions to enable terabit connectivity and drive new generative AI architectures.”

Broadcom can be found on booth 5325 at OFC.

For more information, visit www.broadcom.com


This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.