OFC 2024: Ayar Labs redefines AI infrastructure

Created March 26, 2024
Technologies and Products

Ayar Labs’ will be demonstrating what the company says is the industry’s first CW-WDM MSA-compliant 16-wavelength light source, which can drive 256 optical carriers for 16 Tbps of bi-directional bandwidth – a level of bandwidth essential for AI workloads. One year after introducing the industry’s first 4 Tbps optical solution, (pictured) Ayar Labs is unveiling the second generation of SuperNova, which powers the company’s TeraPHY™ optical I/O chiplet and enables a 16 Tbps of bi-directional bandwidth.



Compliant with the CW-WDM MSA specification, the 16-wavelength light source offers compact packaging, operates at wide temperature ranges, and can supply light for 256 data channels, making it capable of handling the significantly higher throughput required for the massive growth in AI applications.

The company is also working with several industry leaders to demonstrate the value optical solutions deliver for AI applications. Two examples Ayar Labs will be highlighting at OFC:

  • Corning Glass Waveguide Module: Ayar Labs and Corning Incorporated have teamed up to develop a next-generation AI advancement. They have created an optical leadership solution by coupling Ayar Labs’ TeraPHY optical I/O chiplets with Corning’s glass waveguide module, bringing advanced optical capabilities to the AI ecosystem. Ericsson is partnering with Ayar Labs and Corning in this AI-driven solution as part of their technology exploration for future mobile systems. This joint innovation will be shown at Ayar Labs’ booth at OFC. Together, they will highlight how the technologies create future-ready, AI-enabled innovations.
  • Teramount TeraVERSE® Detachable Connector: Teramount and Ayar Labs are showcasing a concept for the next-generation TeraVERSE detachable connector to meet the infrastructure demands of next-generation AI. The detachable fibre connectivity solution features wideband surface coupling, industry-leading bandwidth density, and detachability for reliable semiconductor-grade volume manufacturing of co-packaged optics and in-package optical I/O for AI. Wideband surface coupling offers high bandwidth density with negligible loss-related wavelength dependency, resulting in less lasers, power and fibres needed compared with grating coupler solutions.

“The explosive growth of AI models is breaking the back of existing infrastructure – traditional interconnect technology simply can’t scale to the cost and throughput multi-modal AI systems will require,” said Mark Wade, CEO & co-founder of Ayar Labs. “Our in-package optical I/O solution gives customers the performance and energy efficiency they need as they build out their next-generation AI infrastructure. We’re pleased to showcase this innovation alongside several ecosystem partners at OFC.”

For more information, visit https://ayarlabs.com


This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.