UFO Probe® Vertical: Jenoptik presents new version of its probe card test solution for PIC wafer-level testing

Created October 2, 2023
Product Focus

With the new UFO Probe® Vertical, Jenoptik is expanding its portfolio of probe cards for testing photonic integrated circuits (PICs) at wafer level. Like the previous probe cards, the vertical version is based on the innovative UFO Probe® Technology. This combines a position insensitive optical concept with proven needle technology in a single probe card and is specifically designed for use on standard wafer probers.

The consistent advancement of the technology expands the possibilities of optical coupling: the new probe card version combines the innovative optical concept with the vertical needle technology of established probe card manufacturers. This allows the user to couple up to 32 optical channels in parallel as standard – or more if required – without the need for active alignment. It covers the entire wavelength range from 1260 to 1625 nanometers used in the telecommunications and data communications sector.

Another new feature is the ability to include polarization preservation for individual or all optical channels. By incorporating the vertical needle technology, Jenoptik is responding to the increased market requirements, particularly with regard to co-packaged optics. Here, the trend is towards smaller chips with significantly more and therefore smaller and more densely packed electrical contacts. With the UFO Probe® Vertical up to 6000 bond pads with dimensions down to 35 microns can be contacted. Depending on the needle type, even more. Also, solder bumps and copper pillars are no problem. The smallest addressable pitch of the electrical contacts is in the range of 40 to 80 microns. In addition, the vertical probes provide a lower and more uniform contact resistance in the range of 0.2 to 1.0 ohms, depending on the probe type, while minimizing probe marks. These further developments ensure economical use in high-volume test scenarios and ATE operability.



This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.