ECOC 2023: OIF to achieve milestone with largest ever multi-vendor interoperability demo

News and Business

OIF is planning to showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023, being held October 2-4 in Glasgow, Scotland. 39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) CEI-112G & CEI-224G channels and Common Management Interface Specification (CMIS) implementations. OIF first announced a 400ZR coherent optical interface with an Implementation Agreement (IA) back in April 2020, and the first 3.2T CPO IA in April 2023.

The collaborative efforts of OIF’s network operator, system vendor, component vendor and test equipment vendor members will be on display, illustrating their contributions in driving the adoption of technologies for both present and future networks. OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing. Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.

“OIF stands at the forefront of critical multi-vendor interoperability efforts, driving the industry’s evolution and providing the transformative technical solutions to meet the rapidly growing demand for broadband access,” said Mike Klempa, Alphawave semi and chair of the OIF Physical & Link Layer Interoperability Working Group. “As a member-driven organization, our work remains at the cutting edge, aligned with the industry’s needs and fostering collaboration to accelerate product development and solutions to market. For 25 years, we have been instrumental in facilitating industry progress. This year’s largest-ever demo underscores the vital role we play in shaping the network and the significance of our work in advancing the industry overall.”

For more information, visit www.oiforum.com