OIF launches first 3.2T CPO implementation agreement

News and Business

In its first project under the umbrella of the Co-packaging Framework Document, the OIF has  launched an industry-first, the OIF-Co-Packaging-3.2T-Module-01.0 – Implementation Agreement (IA) for a 3.2Tbps Co-Packaged (CPO) Module defines a 3.2T co-packaged module that targets Ethernet switching applications utilising 100G electrical lanes and provides backward compatibility with 50G lanes. The module definition can be in the form of an optical module or a passive copper cable assembly and provides ~140G/mm of bandwidth edge-density. It can enable optical and/or electrical interfaces for a 51.2Tbps aggregate bandwidth switch.

The new IA includes interoperability specifications for the 3.2 Tbps CPO modules, including:

• 8x400Gbps optical interface options for FR4 and DR4 connectivity32 x CEI-112G-XSR host interface (or 32 x CEI-56G-XSR in “backwards compatible” mode)
• Opto-mechanical module specifications
• Electrical specifications
• Control and management interface, enabled by enhancements to the existing OIF CMIS specification

“OIF’s members are committed to driving innovation and progress in co-packaging, continuously seeking ways to improve and innovate,” said Jeff Hutchins, OIF PLL Working Group Co-Packaging vice chair and board member, Ranovus. “This IA is part of a trio of projects which include the Framework project and the External Laser Small Form Factor Pluggable (ELSFP) project. Building on OIF’s successful track record of coherent and laser module IAs, it addresses the market need for interoperable integrated optics standardisation identified by the CPO Framework IA.”

“Considerable progress has been made in co-packaging, and this new IA, along with a collaborative ecosystem, is a critical piece to propel the technology so that it meets industry needs, including that of Cloud service providers as they build their next-generation AI networks,” said Richard Ward, technical editor of the OIF 3.2T Co-Packaged Module IA, Astera Labs.

At OFC 2023 in March, OIF revealed its progress in co-packaging specifications in a set of interoperability demonstrations. The demos included pivotal multi-vendor elements to enable co-packaging architectures, including live demos for the External Laser Small Form Factor Pluggable (ELSFP) external laser source form factor, co-packaged 3.2T copper cable assemblies, an operating linear optical module, and a variety of optical connectivity solutions as well as an expanded set of OIF member participants representing the growing ecosystem.

For more information, visit www.oiforum.com