OFC 2023: TE, Intel, demo 224G PAM4 over passive copper

Created March 7, 2023
Technologies and Products

TE Connectivity, in collaboration with Intel, is demonstrating its 224 Gbps PAM4 long reach development efforts at OFC 2023.

The first demo consists of Intel’s 224 Gbps test chip addressing TE’s over-the-board (OTB) architecture consisting of a 224 near-chip cable assembly. TE’s 224 Gbps AdrenaLINE Catapult product helps enable premium signal integrity channels for near-chip to near-chip, near-chip to cabled input/output (I/O) ports, and near-chip to cabled backplane architectures in next generation equipment. TE’s fine pitch interconnect technology combined with its copper cable solutions enable cable connectivity in extreme proximity to an ASIC or FPGA at 224G speeds. TE says this can provide notable signal integrity transition to the ASIC or FPGA as required for minimal equalisation, and can enable flexible architectures to help realise next-generation equipment such as switches, routers, and accelerator fabrics.

In the second demo, the same Intel transceiver addresses an octal small form-factor pluggable (OSFP) based channel consisting of TE’s prototype OSFP 224 Gbps connector and cage with a 1-meter OSFP passive DAC copper cable, a long reach objective set by IEEE for its 200G lane rate.

“It is exciting to see the progress that Intel has made in developing 224 Gbps SerDes IP that can help enable next generation networks. Intel is leading the FPGA industry through its world’s first 224 Gbps PAM4-LR transceiver test chip which has demonstrated flexibility, scalability, and excellent power and performance for bandwidth-intensive and reach-flexible applications,” said Nathan Tracy, technologist and manager of industry standards at TE Connectivity.

“TE’s 224G development work based on Intel’s 224 Gbps PAM4-LR transceiver is showing great progress toward helping enable next generation architectures both inside equipment and in between equipment,” said Mike Peng Li, a fellow on SerDes and I/O, Intel Corporation.

For more information, visit www.te.com.


This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.