OFC 2023: Hyper Photonix makes US debut with 400G DR4 transceivers

Technologies and Products

China-based transceiver manufacturer Hyper Photonix Ltd, makes its entrance into the US optical transceiver market at OFC 2023, with a 400G QSFP-DD DR4 module, built on Hyper Silicon™ technology, which has a range of up to 2km. The company will also be demonstrating its family of 400 DR4 and ZR pluggable optical modules spanning 100G to 400G and beyond, aimed at hyperscale data centres, cloud, enterprise, and metro network operators across the United States.

Hyper Photonix says its proprietary Hyper Silicon™ SiPho platform originates from its R&D labs in Asia and provides advanced product performance at the lowest possible cost. Enabled by in-house Chip-to-Transceiver core competencies and a strong commercial foundry partner relationship, Hyper Photonix controls the complete product supply chain from chip design and fabrication to automated chip coupling and testing to transceiver design and manufacturing, and thereby assures customers of consistent on-time order fulfilment and cost-effective product performance over mass production volumes.

“Hyper Photonix is pleased to enter the US transceiver market and offer customers the intrinsic value of a chip-to-transceiver scalable solution platform at a compelling cost per gigabit,” said Xavier Clairardin, CEO of Hyper Photonix. “Our 400G QSFP-DD DR4 Hyper Silicon™ transceiver is fully qualified and we are ramping production capacity aggressively to support Hyperscale Data Center demand. The Hyper Silicon™ platform scales easily to faster lane speeds and higher aggregate data rates, accelerating the release of 800G+ products currently in the final stages of development.”

Hyper Photonix’s parent company was founded in 2015 with R&D facilities in Wuhan China, with a manufacturing base in Ningbo and offices in Tokyo Japan. In 2022, the company established offices in Bellevue, WA, USA.

For more information, visit www.hyperphotonix.com