DustPhotonics, MaxLinear, demo SiPho/DSP

Created August 18, 2022
Technologies and Products

DustPhotonics and MaxLinear have partnered to demonstrate a silicon photonics chipset with integrated lasers directly driven from a DSP without the use of any external driver chip. The MaxLinear Keystone DSP and DustPhotonics Carmel Silicon Photonics chip were shown together to support direct-drive operation, which reduces the overall cost and power dissipation of optical transceivers for data communication. This combined solution is ideal for applications such as 400Gbps and 800Gbps pluggable modules and on-board optics.

The DustPhotonics chip includes an integrated distributed-feedback laser and Low Loss Laser Coupling technology (L3C), achieving efficient coupling of light into the PIC, thereby enabling the use of 1 laser for every 4 channels. The MaxLinear Keystone chip is part of a family of DSPs capable of both 400Gbps and 800Gbps operation, based on TSMC’s 5nm process.  The Keystone DSP provides a set of features for transceivers, CPO modules and on-board optics while achieving lower power than competitive solutions, according to MaxLinear. The integrated drivers are optimised for silicon photonics direct-drive. The companies say the combined solution enables performance that significantly exceeds all IEEE specifications. In terms of power consumption, 400Gbps transceivers can now be designed to reach sub 7W.

“DustPhotonics is focused on enabling best-in-class Silicon Photonics chips to simplify the efforts of transceiver and systems designers,” said Yoel Chetrit, vice president R&D of DustPhotonics.  “Not only can our Carmel chip simplify the overall system design by reducing the total number of lasers to a single laser for 4 channels, but it also eliminates the external driver, which reduces the cost, power and complexity of the overall system.”

“The combination of our Keystone 5nm integrated driver DSPs with DustPhotonics’ silicon photonics demonstrates the significant power and performance advantages achievable with our integrated drivers,” said Drew Guckenberger, vice president of Optical Interconnect at MaxLinear. “With double-digit year-on-year growth in market demand for 400Gbps and 800Gbps transceivers, this integrated solution can create tremendous value for our customers. We look forward to seeing full transceiver deployments in the near future.”

For more information, visit www.maxlinear.com

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This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.