CPO component sales over US$1.3 billion by 2025 – report

Created August 22, 2022
News and Business

A new report from Communications Industry Researchers (CIR), predicts that sales of specialised co-packaged optical components will exceed US$1.3 billion in revenues in 2025 and grow to US$2.7 billion by 2028.

CIR says the commercial potential of co-packaged optical components was recently demonstrated, when Senko Advanced Components acquired Cudoform, specifically for access to Cudoform’s micro-mirror connector in a CPO application. Other CPO components in immediate demand include cooling systems and external lasers. Intel researchers also recently demonstrated an eight-wavelength silicon laser array that Intel believes can be integrated into a CPO package.

The report, Markets for Co-Packaged Optics 2022-2030, also finds that large deployments of CPO systems may not occur until 2027, but CPO module manufacturers are already buying critical co-packaged optical components; a couple of years in advance. CPO components will be the first big opportunity in the coming CPO revolution. However, demand for CPO components will spur manufacturing to meet the demanding requirements for tight-spaced packaging and hard-to-integrate photonics. The goal of Intel’s research laser array is specifically a high-volume chiplet-product. Among those increasingly focused on CPO are merchant silicon firms, which are leveraging the latest silicon photonics technology to exploit this opportunity.

This new CIR report examines the latest developments in connectivity, lasers, and cooling systems for CPO as well as showing how CPO modules will be used in four kinds of data centre. The report forecasts CPO from 2022 to 2030 with breakouts by type of data centre and location (inter-building/inter-machine or rack/server) in the data centre. The report also has a strong emphasis on CPO’s impact on the optoelectronic supply chain in the wake of both technological change and geopolitical developments. Key companies discussed include AMD, Anritsu, Ayar Labs, Broadcom, Furukawa Electric, GlobalFoundries, IBM, Marvell, Lumentum, Ranovus, SENKO, TE Connectivity, Xilinx, and others.

For more information, visit https://cir-inc.com

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This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.