Senko acquires CudoForm for CPO know-how

Created July 20, 2022
News and Business

Senko Advanced Components, has acquired CudoForm, which designs and manufactures of high-precision metal micro-optic components with applications in data communications, consumer photonics, and biosafety. The acquisition will bring together the two global companies, whose aligned and combined product capabilities, says Senko, will drive adoption of advanced and innovative optical interconnect solutions.

Senko says that in today’s fast-paced world, providing solutions to integrate optics with electronics circuits, also known as Co-Packaged Optics (CPO), thus raising optical performance, increasing bandwidth, and reducing power consumption, are in high demand.

“The employees and management of CudoForm are excited to join SENKO,” said Dr. Ryan Vallance, chief executive officer of CudoForm “We recognise the importance of high precision and reliable connectivity for CPO and with the combination of CudoForm and SENKO, we bring together complimentary technology platforms to provide novel solutions that meet the demanding requirements of this tight spaced packaging and difficult to integrate photonics ecosystem.”

With CudoForm’s expertise in high accuracy stamping of metallic components, such as optical connectors, together with its extensive years of research and development, this acquisition will firmly place Senko Advanced Components a major player the emerging and fast-growing optical communications market especially in the field of PIC Interconnect. Also, says Senko, CudoForm’s expertise in accurate beam shaping and directionality will generate new opportunities in high growth areas beyond the primary focus of data center switch interconnect, such as 3D / vr imaging, lidar, digital health and sensing, solid-state lighting and uvc LED pathogen reduction.

“We are very happy about this acquisition, especially because CudoForm is a world leader when it comes to optical interconnectivity. By merging their research and innovative solutions with our expertise we will be able to improve our product development and further strengthen our position in the market. Both organisations share a common mission to deliver the highest performance and innovations to our customers. We look forward to delivering the combined synergies of two industry leading companies to our customers,” commented Kazu Takano – president at Senko Advanced Components, Inc.

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This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.