OFC: Ranovus first with monolithic 100G Optical I/O Cores

Created March 7, 2022
Technologies and Products

Ranovus Inc. has announced the availability of its protocol-agnostic Odin™ 100G optical I/O cores based on GF Fotonix™, GlobalFoundries’ recently announced next-generation, monolithic platform. GF Fotonix™ is claimed to be the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.

Ranovus says Odin 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace. Odin 100Gbps optical I/O scales from 8- to 32-cores in the same footprint by combining RANOVUS’ 100Gbps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.

“We are delighted to share our multi-disciplinary silicon-photonics IP cores and chiplets, and advanced packaging solutions with our customers who are driving the adoption of novel data centre architectures based on integrating best-in-class chiplets and co-packaged optics”, said Hojjat Salemi, Chief Business Development Officer of RANOVUS. “Our close collaboration with GlobalFoundries underlines our joint commitment to deliver a fully featured set of qualified IP cores and chiplets with OSAT-ready high-volume manufacturing flows and supporting ecosystem to enable the huge potential of monolithic silicon photonics.”

As  previously announced, RANOVUS has developed a flexible co-packaged optics architecture (Analog-Drive CPO 2.0) together with a Tier 1 ecosystem for high volume manufacturing of Odin chiplets.  The first customer co-packaged solution with 800Gbps Odin optical I/O is being demonstrated at OFC 2022 with samples based on the GF Fotonix platform shipping now.

“Data centres, computing and sensing applications require incredible processing, transmission and power efficiency as the world’s data needs soar dramatically.”  Ranovus’ IP cores, chiplets and advanced packaging solutions, combined with GF Fotonix, provide customers a complete solution to develop the chips needed solve some of the biggest challenges facing data centres today,” commented Anthony Yu, vice president, Computing and Wired Infrastructure Strategic Business Unit at GF.

RANOVUS can be found at booth #5917 and GlobalFoundries at booth #4604

For more information, visit www.ranovus.com

 

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This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.