OFC: Ranovus, AMD, demo adaptive compute acceleration CPO platform

Created March 3, 2022
Technologies and Products

Ranovus Inc. is to demonstrate a Co-Packaged Optics platform using a Xilinx Versal ACAP and Ranovus Odin™ 800Gbps CPO 2.0.  The joint demonstration between Ranovus and AMD, is the first public showing of the companies’ CPO 2.0 solution for AI/ML platforms that demand power efficient, high throughput and high density optical interconnect.

Ranovus’ Odin™ is a low latency, high density, protocol-agnostic optical engine that delivers optical interconnect bandwidth with cost and power efficiencies.  Odin scales from 800Gbps to 3.2Tbps in the same footprint by leveraging Ranovus’ 100Gbps per lambda monolithic Electro-Photonic Integrated Circuit (EPIC) IP, laser platform, and advanced packaging technologies.

“We announced our Odin™ Analog Drive CPO 2.0 platform at OFC 2021 for Ethernet switch and module applications and are thrilled to showcase our platform with a Versal ACAP for ML/AI workloads,” said Hamid Arabzadeh, chairman and chief executive officer of RANOVUS. “We have been at the forefront of the CPO movement since 2018 and are delighted to share our multi-disciplinary IP cores with our customers who want to accelerate the adoption of Analog Drive CPO in data centres

Ranovus says Versal is the industry’s first adaptive compute acceleration platform (ACAP). Versal ACAPs deliver unparalleled application- and system-level value for cloud, network, and edge applications. By integrating the optics into the package using Versal Premium ACAPs, AMD and Ranovus are able to drastically reduce power, simplify board routing, and reduce cost.

“We’re proud of our collaboration with Ranovus that helped achieve record performance levels while at the same time reducing power and overall footprint of the complete solution,” said Dan Mansur, vice president, Adaptable and Embedded Computing Group, AMD (formerly Xilinx). “This CPO demonstration highlights the versatility of the Versal GTM SERDES to operate over anything from long-reach copper to directly driving the Ranovus Analog-Drive CPO 2.0 optical engine.   Co-packaging Ranovus Odin™ with Xilinx Versal is a significant advancement which enables data center customers to build highly efficient and cost-effective systems for next-generation workloads.”

Ranovus and AMD will be demonstrating this approach to CPO at AMD’s booth #5711 and Ranovus’ booth #5917.

For more information, visit www.ranovus.com


This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.