Ranovus has extended its partnership with IBM, TE Connectivity, and Senko Advanced Components to deliver what the company says it has taken the next step in reducing power consumption and overall costs for hyperscale data centre operations with the introduction of the Odin™ Analog-Drive CPO 2.0 architecture. Co-packaged Optics (CPO) is an innovative approach that provides nx100Gbps PAM4 Optical I/O for Ethernet switch and ML/AI silicon in a single packaged assembly, which significantly reduces the cost and power consumption of the complete system.
Ranovus says that with data centre traffic growing at an unprecedented pace, fuelled by advances in AI and Machine Learning, the networking infrastructure must scale in capacity while maintaining its total power consumption and footprint. The strategic collaboration which was announced in March 2020 between Ranovus, TE, IBM, and SENKO, known as CPO 1.0, has enabled a multi-sourced solution to further meet this challenge.
According to Ranovus, CPO 2.0 offers a 40% cost and power consumption savings by eliminating the re-timer function in the optical engine; a cost-effective single die solution; a smaller footprint and the reuse and optimisation of existing 100G PAM4 and PCIe Ser/Des chips versus new investment in an XSR Ser/Des chip for data centre applications. Customer trials with Odin™ Analog-Drive CPO 2.0 are planned in Q4 2021.
“We launched Odin™, our next generation monolithic EPIC and laser platform for multi terabit Co-Packaged Optics (CPO) applications in data centres, in March 2020,” says Dr. Christoph Schulien, EVP of R&D and Systems at Ranovus. “The Odin™ platform is a low latency, high density, protocol agnostic monolithic optical engine that delivers massive optical interconnect bandwidth with industry-leading cost and power efficiency. The Odin™ Analog-Drive configuration eliminates the re-timers in the CPO 1.0 configuration, which brings about a 40% cost and power reduction to the overall system.”
“IBM is enthusiastic to bring to this collaboration more than 45 years history in microelectronics packaging and its deep experience in optical packaging,” said Paul Fortier, senior engineer, IBM business development. “IBM’s optical assembly processes leverage our automated high-volume semiconductor packaging and IBM’s Assembly and Test division provides the co-packaged optics ecosystem with a seamless end to end manufacturing capability.”
“TE is bringing a holistic solution set to the Co-Packaging effort with our electrical interconnect CP socket technology that can enable CPO miniaturisation along with reworkability,” said Nathan Tracy, Technologist, TE Connectivity, “TE’s thermal bridge technology can be a key enabler to the high-density packaging and extreme thermal management necessary for co-packaging.”
“SENKO is pleased to contribute our product designs, and IPs to enhance the design capability, scalability, and flexibility for the Co-Packaged Optics embedded products.” Said Tiger Ninomiya, (Technology & Innovation Manager) at SENKO. “Innovative optical connectivity solutions are key to making Co-Packaged Optics’ solutions a success in the market.”
At the end of 2020, Analyst Communications Industry Researchers (CIR), published a report stating that the Co-Packaged Optics market (CPO) will reach around US$344 million by 2026 going on to US$2.3 billion by 2030. CIR says that although CPO is currently associated primarily with data centre transceivers operating at 800G and above, it sees opportunities for CPO in edge and metro networking, high-performance computing and sensors. Nonetheless, to reach these revenues, it says, telecom and computing industry must work quickly to create new CPO products and standards.
For more information, visit www.ranovus.com.