PIXAPP launches prototype packaging platforms for early-stage photonic device test and evaluation

Created October 2, 2020
Technologies and Products

PIXAPP, which claims to be the world’s first open-access Photonic Integrated Circuit (PIC) assembly and packaging pilot line, has introduced two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices. The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that need fast and cost-effective PIC packages with 10s to 100s of electrical connections.

Off-the-shelf designs are available in volumes from 5 to 1000 units for rapid prototyping using the PIXAPP-GCP-10 design. For PICs with larger electrical and optical connections, the more flexible PIXAPP-GCP-100 design is available. These prototype packages add to PIXAPP’s established advanced photonic packaging services, helping users speed-up the development of their new photonic-based products. The prototype packages offered are based on PIXAPP’s standardised packaging building blocks, including standardised optical and electrical interconnects, thermal and mechanical components.

This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N° 731954, in Public Private Partnership with Photonics 21 (www.photonics21.org)

PIC technologies enable the development of compact and low loss photonic systems for applications such as: 100G-400G TOSA & ROSAs, optical switches, CWDM, DWDM, SFP/SFP+ transceivers and more. They reduce power requirements and allow systems to operate at higher speeds.

“We are excited about the launch of these new standard prototype packages that support companies in the early stage of product development and evaluation. We believe these packages will benefit users across many application areas, including optical communications, medical devices and other emerging industrial markets” said Peter O’Brien, director of the PIXAPP Pilot Line.

Since 2017, PIXAPP has led and coordinated efforts with Europe’s leading photonics research institutes and companies to standardise advanced packaging processes and coordinate the manufacturing supply chain, working with design houses, device foundries, companies providing packaging components and services, and manufacturers of automated packaging equipment.

For more information, visit www.pixapp.eu





This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.