CompoundTek 106Gbps PAM4 MZI Si modulator reduces time-to-market

Created July 14, 2020
Image: PixabayTechnologies and Products

Singapore-based CompoundTek, a global foundry services provider in emerging silicon photonics (SiPh) solutions, has announced the addition of a high-speed 106Gbps PAM4 MZI Si modulator to its portfolio. The company says the modulator offers customers capabilities in 400G/600G/800G applications and ‘extraordinary’ levels of productivity. Further minimising manufacturing risk with fewer respins, customers can expect improved yield results in a better return on investment and accelerated time-to-market.

“This innovation is line with CompoundTek’s services expansion goals, ensuring we bring to customers, solutions that save both time and significant investment dollars while meeting performance metrics throughout their prototype-to-market journey. With this transceiver-focused IP design, customers looking to strengthen their 400G to 800G capabilities and reduce the number of iterations can be assured that critical pain points are addressed,” explains K.S.Ang, chief operating officer of CompoundTek.

The modulator is a critical integral component in the transceiver design and the availability of the leading edge 106Gbps PAM4 MZI Si modulator will accelerate the development of CompoundTek customers’ next-generation SiPh products, specifically in the transceiver market.  Its performance has been verified both on simulation and on-chip fabricated through CompoundTek’s proprietary process flow, with measurements undertaken by a third-party independent company. Showing above typical industry standards test results, the 2.5mm length modulator’s typical reach is 3dB OE bandwidth of 40GHz @ 4V, 3.25 dB loss, 4dB Extinction Ratio (ER) with modulator efficiency of 17 V.mm. Recognising its potential, a leading commercial customer has recently licenced this special IP block, leveraging CompoundTek’s post-fab Cu pillars/bump integration with suspended edge coupler, and Si deep trench for electronics circuits integration.

CompoundTek says design flows continue to mature to meet the cost and scalability demands of manufacturing necessary for broad commercial markets. Today, SiPh integrated circuits are more widespread particularly in applications related to datacom, radio frequency (RF), and sensing. In 2019, shipments of SiPh transceivers for datacentres reached almost 3.5 million units with revenues approximately US$364 million attributed largely to the development of silicon photonics transceivers for telecom/datacom applications, according to Yole’s Silicon Photonics Market and Technology 2020 report.

Image:© Pixabay

For more information, visit https://compoundtek.com

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This article was written
by Peter Dykes

Peter Dykes is a independent telecoms and technology journalist who has over that last 30 years written for a wide range of B2B publications and companies. A former BT engineer, he specialises in networks and associated support systems. He is currently Editor of Optical Connections.