400G capable high-speed connector system for Data Networking market
Yamaichi Electronics has expanded its high-speed connector product portfolio with a new small form factor connector for 400 Gigabit data networking applications and cage assembly mechanical parts.
QSFP-DD is one of the new small form factors. It was standardised by QSFP-DD MSA. Yamaichi Electronics is one of the active MSA members. QSFP-DD is similar to the current QSFP, but there are additional contact rows inside the structure design to realise double density by 8 channels for electrical signal transmission. Our mechanical design is QSFP-DD MSA compliant. It is also backwards compatible to the current QSFP.
Features and advantages
Yamaichi Electronics has a lot of experience in the design of high-speed connectors. The design structure and electrical performance of the new QSFP-DD connector benefits from this know-how and expertise. The connector is designed for 200G and 400G technologies and to support 28 Gbps per channel NRZ, and 56 Gbps per channel PAM4 modulation. Moreover the signal integrity takes into consideration 112Gbps per channel PAM4 modulation. This outstanding electrical performance is unique on the market so far.
Different mechanical versions available
Yamaichi Electronics is proud to provide the suitable product for the next generation of data networking market applications. The single-type connector together with the mechanical assembly kit were released into the market. The series will be expanded to the multiport-type connector soon.
Yamaichi Electronics also offers customised heatsink solutions. In addition it is planned to provide the stacked QSFP-DD later during 2019. Thus Yamaichi Electronics provides the complete QSFP-DD product series to support the customers´ requirements for their applications.
Yamaichi Electronics Showcases CEI-112G Interoperability Live Demo at ECOC 2019 in Dublin
OIF (Optical Internetworking Forum) member company Yamaichi Electronics will showcase its expertise in data networking interface technology with a multi-vendor interoperability live demonstration of CEI-112G-VSR-PAM4 during ECOC 2019, September 23-25 in Dublin, Ireland.
Demonstrating how critical interoperability work gets done, 12 OIF member companies including Yamaichi Electronics will participate in the Physical and Link Layer (PLL) live demo in OIF’s booth, # 441. The demo will feature Yamaichi´s electrical interface solutions that are critical to the global network, including CEI-112G-VSR-PAM4.
CEI-112G Live Demo
OIF together with Yamaichi Electronics is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G-VSR-PAM4 live demonstration in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD provided by Yamaichi Electronics.
About Yamaichi Electronics
Yamaichi Electronics is a market leader for Test & Burn-In sockets, connectors and connection systems. Their reliability and functional dependability are absolutely essential for the success of the overall project. Yamaichi Electronics established themselves on the world market very quickly as a manufacturer of high-quality, reliable components for demanding applications in various markets and applications: semiconductor, industrial automation, automotive, data networking, measurement & testing, medical, mobile computing, embedded computing, and others.
Yamaichi Electronics Deutschland GmbH
Concorpark, Bahnhofstr. 20, 85609 Aschheim-Dornach, Germany
Tel. +49 (0)89 – 4 51 09-0
Fax: +49 (0)89 – 4 51 09-110