Latest Product News

Created March 14, 2019
News and Business

In this time of high demand and innovation, Optical Connections brings you the latest products from the fibre optic industry.

 

End to End Fibre Network Solutions

HellermannTyton provides a complete end to end range of Fibre to the X (FTTX) solutions, delivering flexible fibre connectivity across every stage of the last mile network.
The comprehensive range of street cabinets, fibre splice closures, MDU enclosures,
customer connection points and wall outlets, delivering fibre to the home in both underground or
over-ground (aerial) applications.

The FTTX last mile product range from HellermannTyton offers quality connectivity at every stage of the network from the central office all the way to the inside of a property where the fibre connects to a router. Starting with a street cabinet or the larger UFC fibre splice closure where the fibre cables are at their highest density, they are then routed along the network to the next phase of connectivity.

There is no set design for a fibre network which means different operators have very different fibre requirements at the various stages of the network. HellermannTyton have committed a large amount of research and resource into developing a range of products that offer the best fibre connectivity at each of these stages.

Inside the building, there is the new MDU series which currently offers 3 different enclosures; the S5 being the largest presenting up to 432 managed fibre splices, down to the S1 with 8 dedicated customer fibre connections. Looking at individual properties you then have the CCE or the CCP which takes the fibre from outside the property or house inside and connecting to the FWO which then takes the fibre to the router or other active hardware. Outside the building, there is also a range of IP rated enclosures that manage fibre from the street to the property. The AFN offers up to 24 connectorised fibres and the FFE a slightly small enclosure offers 8 fibre connections. For more information on any of these products please come and see HellermannTyton on Stand S22 at FTTH Amsterdam or visit www.htdata.co.uk


No data traffic without Axetris microlenses

Axetris has been providing microlenses to the communication industry for more than 15 years and microlenses are omnipresent in telecom and datacom solutions such as wavelength selective switches, optical transceivers for data centers and long-haul coherent communications components.

It all started with Passive Optical Network (PON) components for the megabit telecommunication era. Today, Axetris contributes cost-attractive microlenses to the advance of Gigabit internet age, where hyperscale data centers and service providers require more efficient, economical and faster solutions.
Customized silicon and fused silica microlenses and microlens arrays
Axetris microlenses are made of high-quality optical materials like silicon and fused silica, which have optimal properties for optical communication solutions. We produce microlenses with customized lens designs and also auxiliary features, such as fiducials and metal-or solder pads. Microlens chips are provided in the form of single lenses or 1- and 2-dimensional lens arrays, which cover single- and multi-channel coupling schemes.

Advantages
We supply sub-millimeter chip size, down to a few hundred microns with thicknesses down to of 100 μm, which enables compact packaging and miniaturized optical setups. Microlenses are manufactured by well-established micro-machining processes, the same techniques used in silicon photonics fabrication: photolithography, thermal reflow, and plasma etching. These micro-machining techniques guarantee sub-nanometer surface roughness, high-precision pitch accuracy for microlens arrays, and good control of the lens shape for customized lens designs. The wafer-level processes allow scalability to high volume production and eventually cost-attractive solutions.


US Conec boosts density by 3X with new MDC connector 

The MDC connector is a very small form factor two-fibre connector manufactured with proven 1.25mm ferrule technology used in industry standard LC connectors.

Three port MDC adapters fit directly into the standard panel opening for duplex LC connectors, increasing fibre density by a factor of three. Supporting port breakout architectures for emerging transceiver MSAs, this smaller size will allow a single array transceiver to accept multiple MDC patch cables which are individually accessible directly at the transceiver interface. The new format will support four individual MDC cables in a QSFP footprint and two individual MDC cables in an SFP footprint.
Insertion and extraction of the MDC connector occurs with a simple push or pull on a flexible and robust strain relief boot. The unique boot design allows for functional density in very tight spaces. For faster error free installations, an optional aggregation component will allow for insertion and removal of multiple MDC connectors at once.
Polarity of MDC connectors is effortlessly changed in the field or factory to support multiple cabling methodologies without the need for tools and without exposing or twisting delicate fibres. The MDC connector is designed for optimal stability exceeding the requirements Telcordia GR-326 for carrier or data centre applications.
Please visit US Conec in Booth 3131 at OFC 2019 for a demo of the MDC connector in addition to US Conec’s portfolio of high-density optical interconnect products.


Intel® Silicon Photonics 100G CWDM4 QSFP28 optical transceiver with extended temperature range

The Intel® Silicon Photonics 100G CWDM4 QSFP28 Optical Transceiver product family is expanding! We are now sampling extended temperature products for 5G wireless applications. Features include a temperature range of -40°C to 85°C, dual rate 40G/100G CPRI and eCPRI, and a reach of up to 10km. Visit www.intel.com/siliconphotonics for more information.

 


Triple your density with SN™ connector

SENKO’s SN™ connector, utilising standard LC Ferrule technology, the duplex connector allows you to triple the density compared to the conventional LC Connectors. The SN™ is also designed to fit four of the duplex connectors in one QSFP footprint transceiver for direct breakout, increasing your density, while still exceeding GR-326 requirements.


Unleash a New Era in OSP Fibre Management

Go!Foton’s OSP High-Density Fiber Distribution Hub (FDH) is a revolutionary new concept in OSP fibre connectivity management which is built upon the highly agile, award-winning PEACOC™ technology platform.

Go!Foton’s OSP High-Density Fiber Distribution Hub (FDH) is a revolutionary new concept in OSP fibre connectivity management which is built upon the highly agile, award-winning PEACOC™ technology platform.

The PEACOC FDH incorporates high performance PLC splitters, patching, splicing, and connector parking in a highly compact and modular design. The distinctive “wing-based”
fibre routing panel provides a highly craft friendly approach to managing the dense field of splitter pigtails and fibre jumpers.

The highly innovative Go!Foton PEACOC FDH is unlike any other fibre distribution hub on the market today. It is a fully integrated platform that forms the foundation on which small form factor jumpers and a multitude of PON components can be easily incorporated and managed in a highly compact OSP enclosure. It’s the only FDH platform capable of supporting simplex LC connectors with full front-side access for easy fibre management that is fast, highly organized, and accurate. With up to 432 subscribers in a highly compact, attractive enclosure, service providers will finally have greater flexibility when deploying OSP fibre in areas that are historically reluctant to approve right-of-way access for traditionally larger enclosures.
Available as both a hermetically sealed dome enclosure or an equally compact pole, wall or strand mount enclosure, the PEACOC FDH brings GoFoton’s patented PEACOC technology to the OSP to support the increasing need for high density fibre distribution in support of 5G, CRAN, and other next generation PON topologies.

With the new PEACOC™ FDH, the engineers at Go!Foton have unleashed a new era of OSP fibre management by implementing a solution which offers FDH installers phenomenal front side access to all cabling, splices, and optical components while maintaining their commitment to provide a craft friendly approach that is fast, easy, and reliable.

By providing this functional modularity, and flexible cable management, the Go!Foton FDH can be customized to meet the needs of new and emerging optical distribution network requirements. The PEACOC wing-based FDH is available in both a traditional cabinet solution targeted at pole, wall, and pad mount applications, as well as a hermetically sealed dome enclosure suitable for underground deployment.


Albis Optoelectronics present new 56 Gbaud PAM-4 photodiode with enhanced responsivity

Albis Optoelectronics is a leading designer, developer and manufacturer of high-speed photodiodes. For more than 15 years, the company has been offering the broadest portfolio of Telcordia qualified InP and GaAs photodiodes for datacom and telecom applications in the industry.

At the upcoming OFC in San Diego, Albis will present its new PD40C1 photodiode chip with enhanced responsivity on booth 4325. The topside illuminated p-i-n photodiode structure is optimised for 56 Gbaud PAM-4 (400GBASE-DR4 and 400GFR4), single-mode telecom and microwave photonic links, RF over fibre as well as test and measurement applications. The cost effective, small sized chip offers an excellent responsivity of 0.8 A/W at 1310nm. The groundsignal- ground pad configuration enables easy and direct bonding to any TIA pad layout.
All photodiode products are completely manufactured inhouse in Albis’ dedicated cleanroom facilities. Product highlights include: PIN photodiodes for 10G, 25G and 40G digital and analogue receivers. Low bias, top illuminated APDs for 2.5G and 10G OLT/ONUs. 25G APDs for 28 Gbaud PAM-4 and 100GBASEER4 applications. Side-illuminated monitor diodes and monitor diode arrays. Photodiodes with integrated lenses and optical filters. And last but not least hermetically packaged, short and long wavelength microwave photodetectors up to 30 GHz.


Largest fibre draw furnace ever made – Nextrom’s NIF 230

In the past 4 years, the shortage of optical fibre triggered very large equipment investments to increase the worldwide fibre production capacity; Nextrom largely contributed by supplying many new draw towers and proof testers. Some companies chose to improve their draw capacity by increasing the preform sizes, and mainly invested in larger draw furnaces and dual take-ups. Larger preforms help reducing the setup times and increase the overall draw equipment efficiency (OEE).
Nowadays the typical diameter of preform made by VAD-OVD is in the range of 150 mm to 170 mm. Preforms made by VAD-RIC© are up to 215 mm in diameter. However, both cladding technologies are improving and soon the diameter of preforms would increase to 230 mm.
With this challenge in mind Nextrom developed probably the largest draw furnace ever made – NIF 230, based on proven technology of the previous NIF 200 Induction Furnace. Nextrom offers multiple options to customise every furnace system to specific customer products and needs. Nextrom NIF furnaces can be installed into existing and OEM draw towers for better productivity results.
Benefits:
– High process speeds up to 3000 m/min.
– Preform max. diameter/length – 230 mm/8,5m.
– Excellent control of fibre diameter, down to 0.1 um clad deviation.
– Dynamic iris for drawing uneven preforms with variations of +/- 12 mm. l Low energy consumption, typically 42 kW for 150 mm performs. l Inert process gas type – only argon gas is required.


Suncall America Inc 2019 new products debut

Internal shutters have become the norm and SUNCALL AMERICA is proud to reveal our new and improved version this year at OFC in San Diego.

We will be introducing the new LC Internal Shutter Slim-Pack Adapters. No more dust cap install and removal!
– Cut down dust contamination risks immediately once connectors are removed.
– Fits standard LC adapter cutouts. (9.4mm adapter height)
– Shutter ports operate individually
– Designed for no contact of Ferrule to shutter doors upon insertion.
– Reduce laser retinal damage risks to field operators.
Shutter options include:
– White shutters
– Colored shutters to match or mismatch with adapter housings
– Tinted translucent shutters
– Vertical spring/latch type allows side by side mounting with no flanges or cluster bands.
– Side springs/ latch type also offered for vertical stacking or individual cut outs.
– No Cleaning stick attachment required.
– Non-stick shutter doors for smooth movement.
Please visit us at SUNCALL AMERICA INC booth # 4321 and see the new LC INTERNAL SHUTTER ADAPTERS and watch our animation of how they work!
OTHER NEW ITEMS DEBUTING IN EARLY 2019 MPO INTERNAL SHUTTER ADAPTERS:
Built-in internal shutter provides dust and laser protection. A variety of colors and translucent shutter options available.
SC INTERNAL SHUTTER ADAPTERS
Standard SC footprint simplex adapter with built-in internal shutter which offers more safety for FTTH applications. LC UNI-BOOT with improved push/pull tab.


iXblue offers golden optical reference transmitters up to 56 Gbauds and 70 GHz

iXblue Photonics has engineered test solutions for the Telecommunication industry and provides Optical Reference Transmitters based on proprietary LiNbO3 high speed modulators. These ModBoxes address the Telecom market and are designed to be Golden Transmitters that generate robust and reliable optical eye diagrams. They are compliant with IEEE norms for high-speed test solutions and are used in the development and qualification of next-generation telecommunications, Datacom, Long-Haul and other optical interfaces.
The Optical Reference Transmitter ModBox addresses the Telecommunication and Datacom networks equipment markets. The ModBox is a flexible and efficient Electrical to Optical converter. It is designed to generate linear or digital standard telecom modulation schemes such as NRZ with and without adding impairments, NRZ up to 56 Gb/s, DPSK up to 28 Gb/s, QPSK and PAM-4 up to 56 Gbaud and VNA up to 70 GHz.
The ModBox-PAM4 generates excellent quality optical data streams PAM-4 up to 56 Gbaud and NRZ up to 56 Gb/s. The transmitter produces very clean eye diagrams with high SNR and fast rise and fall times. They reach incomparable optical modulated output power with 5 dBm at 850 nm, 1310 nm or 1550 nm. The PAM-4 ModBox also allows external interference injection for optical stress eye generation.
The ModBox-VNA are optical transmitters designed to extend the Vectorial Network Analyzers applications into the optical domain. When associated with a Vectorial Network Analyzer, they make up a high- performance and easy to use test equipment for the characterisation of photoreceivers or any highspeed
optoelectronic device.
iXblue will be exhibiting during the next OFC, a chance and opportunity to talk about your project and ModBox needs. To book your appointment please contact contact.photonics@ixblue.com.


Rockley announces silicon photonics platform for sensing AI

Rockley Photonics, a vendor of integrated optics for high-density digital systems, has announced the completion of its fully integrated silicon photonics platform running in a large-scale foundry environment. The company says it has successfully overcome significant technological challenges that have, until now, held back the broad adoption and implementation of integrated photonics in high-volume applications. Chipset shipments to Rockley customers have begun and products implementing them will ramp up the production curve.
The integrated photonic platform delivers low-cost, high-value wafer scale processing to photonics. It is key to many product opportunities in applications where Rockley has go-to-market partnerships including optical sensing, 3D laser imaging and AI computing connectivity. It solves a large number of key issues experienced by wwafer-scalesilicon photonics to date.


ViaLite Launches C-Band RF over Fibre Link

ViaLite has launched a new C-Band RF over fibre link. With a C-Band uplink/downlink frequency range of 3.4–7.1 GHz, the link is suitable for use in a wide range of satcom and broadcast applications, as well as some surveillance and weather radar systems. The link’s full frequency range is 500 MHz – 7.5 GHz.
By removing the requirement for an up/down converter to convert signals to an IF band, the module reduces deployment costs and complexity. Another benefit is that there is virtually no signal attenuation across the site from the dish to the operations centre. The ViaLiteHD C-Band Link is available either as a rack chassis card or as a new purple OEM module, and comes with a five-year warranty as standard. “The C-Band Link has the highest frequency band of all our RF over fibre links and we anticipate it generating a lot of interest,” said ViaLite Marketing Manager: Natasha Miller.
The new C-Band Link products will be showcased at CABSAT in Dubai this March, where the company has a stand on the Satellite exhibition floor (stand: B5-22). ViaLite will be sharing the stand with its distributor for the region, Symbolise, whose managing director Jeroen Husken will also be in attendance.

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This article was written
by Optical Connections News Team