Scotland’s Optoscribe, a supplier of 3D glass-based integrated photonics components, and Japan’s Sumitomo Electric Industries have announced the formation of a strategic partnership, to provide multicore fibre (MCF) components for data comms and telecoms applications.
Optoscribe’s 3D integrated circuits combine embedded waveguides and high precision micro-machining for applications ranging from data centre optical transceiver interconnects, to fibre connectivity and consumer electronics.
The cooperation will “seed the market for practical use cases of Sumitomo Electric’s MCF interconnects”, said the partners. This is especially true, they said, for four core (or greater) MCF fan-in/fan-out components based on 3D glass-based photonic technology in datacom applications, where ultra-high density optical interconnects are required.
Nick Psaila, CEO of Optoscribe, said: “We see this partnership as a great opportunity to jointly address the performance challenges faced by data comms and telecoms applications, while creating and fostering the supply chain for further deployment of multicore fibre and related technologies.”
Tatsuo Saitoh, head of the optical communication laboratory at Sumitomo Electric, said: “We believe that both companies with their cutting edge technologies can create a new market and ecosystem for multicore fibre-based interconnects. We are excited that our products will address customers’ challenges around ultra-high density optical connections.”
Formed in 2010, Optoscribe uses its laser direct write technology to manufacture glass-based integrated 3D photonic components for various industries. In 2017, Optoscribe closed a series B investment round of £1.8m led by Scottish investment syndicate Archangels, and also supported by existing investors Par Equity, Scottish Investment Bank and the Optoscribe management team.
Sumitomo Electric Industries has over 250,000 employees working at more than 390 group companies in 40 countries.
For more information, visit www.optoscribe.com