The highly configurable, MRSI-M3 platform provides 3-micron accuracy, automation, speed and reliability, in-situ assembly processes such as eutectic die bonding. UV epoxy die attach and flip chip assembly are also possible.
From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.
The MRSI-M3 3-Micron die bonder is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.
The product comes with force control, 360° die orientation and programmable multi-colour lighting as standard, but can also be customised to specific user requirements.