Advanced fibre optic components manufacturer, Molex Incorporated offer a full range of solutions for networking, telecommunications, industrial, medical, military, and other industries. Dedicated to providing the right signal speed, design flexibility and scalability to propel next-generation system architectures, Molex state-of-the-art technologies address challenges in data centres and other resource intensive applications. During OFC Molex will feature end-to-end platforms designed for highspeed networking, including the Molex QSFP+™ and zQSFP+ AOC interconnect systems, iPass+™ high density AOCs, and the Impel™ 25 Gbps backplane system, in addition to FlexPlane™ optical flex circuitry, VersaBeam™ MT interconnects, compact VITA 66.1 ruggedized optical MT backplane interconnects, and optical EMI shielding adapters for harsh environment networking applications.
Molex is among the founding members of the CDFP consortium of companies dedicated to defining specifications and promoting adoption of interoperable 400Gbps hot pluggable modules. Also on display will be the new zCD™ interconnect system for 400 Gbps next-generation telecommunications, networking and enterprise computing environments. Formats will include a short body version for passive or active copper cables and long body version for AOCs or transceivers, the zCD interconnect offers the fastest, densest connector on the market today.
Molex are exhibiting at OFC – Stand 3863