Albis Optoelectronics recently confirmed further expansion of its portfolio of mounted photodiodes, with the development of its avalanche and pin photodiode portfolio, which can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.
The PS20X4 consists of an array of four, flip-chip soldered 28 Gbps lensed photodiodes that can be used as the core building block inside a 100G ROSA module.
Product highlights include: PIN photodiodes for 10G, 25G and 40G digital and analog receivers; Low bias, top illuminated APDs for 2.5G and 10G OLT/ONUs. Side-illuminated monitor diodes and monitor diode arrays. Photodiodes with integrated lenses and optical filters; Hermetically packaged, short and long wavelength microwave photodiode modules up to 30 GHz.
All photodiode products are completely manufactured in-house, in fully owned clean-room facilities.
In order to support the surge in demand for its high-end products the company will be doubling its work force and production infrastructure throughout 2017.